Magnetron Sputtering System
Specification
Deposition source: 3 sets of Magnetron Cathode with shutter
Power source: 2 sets of DC(1kW)
1 set of RF (600W)
Sample loading: Load lock chamber
Substrate: 4inch (Rotation and Heating)
Process gas: Ar, O2, N2, C2H2
Pumping system: Turbo pump and Oil rotary pump
Ultimate pressure: 5 x 10-7Torr
System control: Touch panel and PLC.
Tel : +82-31-411-5895 / Fax : +82-31-411-5890 / E-mail : m5898@naver.com
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