Magnetron Sputtering System

Specification

Deposition source: 3 sets of Magnetron Cathode with shutter

Power source: 2 sets of DC(1kW)

                    1 set of RF (600W)

Sample loading: Load lock chamber

Substrate: 4inch (Rotation and Heating)

Process gas: Ar, O2, N2, C2H2

Pumping system: Turbo pump and Oil rotary pump

Ultimate pressure: 5 x 10-7Torr

System control:  Touch panel and PLC.